3/5 watts ultraviolet laser marking machine for marking glass, crystal, transparent materials

Delivery term:The date of payment from buyers deliver within days
  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Beijing

  • Validity to:

    Long-term effective

  • Last update:

    2017-06-30 02:55

  • Browse the number:

    115

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Company Profile
Beijing HBS Science & Technology Co.,Ltd
Contactaixin:

hengboshan(Mr.)  

Email:

telephone:

Arrea:

Beijing

Address:

3B, Unit 1, ZhongHaiFuYuan, No.37 Zengguang Rd., Haidian Dist., Beijing, China

Website:

http://www.markingmachine2001s.com/ http://www.matlockdrains.com/com/hengboshan/

Product details

ULTRAVIOLET LASER MARKING MACHINE
HBS-ZG-3


Technical Parameter


Model

HBS-ZG-3/HBS-ZG-5

Laser Power

3W  5W

Laser   Wavelength

355nm  266nm

Beam Quality

<2

Marking Area

50mm*50mm/100mm*100mm

Marking   Speed

<=7000mm/s

Q Frequency   Tuning

8Khz-15Khz

Min. Line   Width

0.01mm

Min.   Character Size

0.2mm

Repetition Accuracy

+-0.003mm

Power   Consumption

2kW

Power Supply

220V/Single-Phase/50Hz/10A




Product Introduction
Ultraviolet Laser Marking Machine is self-developed by HBS and has the world's most advanced technology. It has following features: high electro-optical conversion rate, long working time of nonlinear crystal, high stability, high positioning accuracy, high operation efficiency, optimized modular design for convenient installation and maintenance. Equipped with two-dimensional automated workstation, it can realize marking continuously in multi-stage or large-size marking. The laser marking line is very fine that suitable for marking with high demand, it's mainly applied to mark the products such as LCD screen, IC wafer and IC chips.
Applicable Materials & Industry
Mainly used in the marking and surface processing of materials such as of all sorts of glass, TFT, LCD screen, Plasma screen, textile products, ceramic chip, mono-crystal silicon wafer, IC chip, sapphire and thin polymer film. The main advantage of Ultraviolet laser is in the complementing of the shortcoming of other bandwidth lasers in precision machining and processing of special materials.